Boncom NIP2 Process Platform – Overview

The Boncom NIP2 process platform is a GaN-based IPD (Integrated Passive Device) platform. Built on mature and advanced manufacturing processes, it offers excellent heat dissipation and high voltage tolerance, meeting market demands for high-power, high-frequency RF front-end solutions. The platform supports operating voltages up to 200V and provides high-precision passive components including resistors, inductors, and capacitors, enabling high-performance, compact designs.

Boncom NIP2 – Technical Services

• Wafer sort (CP) service
• FIB processing and analysis
• SEM inspection
• Wafer thinning and dicing

Boncom NIP2 – Process Advantages

• Perfectly compatible with GaN-on-SiC wafers
• Superior heat dissipation
• Significantly improved circuit efficiency

We also welcome onsite discussions with you at:

• 2026 Hangzhou International Semiconductor & IC Industry Innovation Exhibition (May 14–17, Booth 6A033, Hangzhou Grand Convention and Exhibition Center)
• 2026 China Zhejiang (Haining) Semiconductor Equipment & Materials Expo (May 15–17, Booth B48, Haining Convention and Exhibition Center)