- Thinning: 4"/6" SiC thinning to ≥75μm; 4"/6" Si thinning to ≥200μm
- Laser Scribing: 4"/6" SiC, 50-500μm thickness, chipping ≤15μm, minimum scribe street width of 60μm
- Blade Dicing: 100μm SiC-scribe street ≥60μm; 100μm GaAs- scribe street ≥30μm
- Die Pick & Sort: Chip sorting from ≥400×400μm down to UV film
- Other Process Services: Single-step process services available at various stages per customer requirements
Wafer Fabrication
Advanced Nodes. Quality Foundry.
Packaging Services
Precision Packaging. Superior Interconnect.
Specialty Technologies
Differentiated. Deep Customization.
Design Support
Full Testing. Quality Assured.
