About Boncom

Founded in 2022, Boncom (Jiaxing) Semiconductor Technology Co., Ltd. ("Boncom Semiconductor") is a leading domestic integrated service provider of compound semiconductor IC manufacturing. Headquartered in Jiaxing, Zhejiang, the company offers wafer fabrication, packaging services, single-step process services, and design enablement.

Boncom Semiconductor has built a domestically leading 4-inch high-grade SiC-based GaN specialty process line, supporting R&D verification, pilot production, and volume manufacturing. This effectively addresses critical industry pain points — such as difficult MPW access and slow validation cycles — accelerating the transition of domestic chips from lab to market. Our products serve a wide range of sectors, including specialized communications, 5G, automotive electronics, new energy, industrial control, power supplies, home appliances, security, networking, and consumer electronics.

Led by a National Talent Program leading expert, who is also a recipient of the State Council Special Government Allowance and a national talent program evaluation expert, the company has assembled a professional team of over 70 members. Most core team members graduated from top universities and bring years of cross-border experience in compound semiconductor wafer fab construction, process development, and product operations.

Boncom Semiconductor will continue to focus on compound semiconductor specialty processes, driven by technological innovation and capacity expansion, to build a globally competitive compound semiconductor manufacturing platform.

Company Culture

Aim High

Think beyond. Stay ambitious. Be inquisitive. Drive your own growth. Strive for excellence.

Stay Grounded

Do what's right, not what's told. Stay steady, stay resilient, and solve Boncom's problems the Boncom way.

Work Hard

Sense of urgency. Resourcefulness. Relentless innovation. Courage to take challenges.

Win Together

See the big picture. Put customers first. Share success. Work as a team.

Our Vision

Quality chips independently made for everyone!

Our Mission

To be the leading integrated service provider in compound semiconductor IC manufacturing.

Industry-Academia-Research Platform

Boncom and the Hangzhou Institute of Technology of Xidian University (XDU-HIT) have established the Microwave Integrated Circuits Joint Innovation Center in 2025. The Center aims to integrate Boncom Semiconductor's industry and market strengths with XDU-HIT's expertise in R&D and talent development. Its goal is to incubate pioneering, disruptive, and transformative technologies, attract and cultivate leading talents aligned with market needs, achieve breakthroughs in innovation and industrial demonstration, and establish a university-industry collaborative innovation hub.

XDU-HIT is a major sci-tech innovation platform co-founded by Xidian University and local government to advance industry-education integration. Its core mission is talent cultivation through such integration. Guided by the "315" sci-tech innovation system, XDU-HIT focuses on high-level talent recruitment, cutting-edge research, efficient technology transfer, and high-tech industry clustering. It actively explores an integrated development model combining education, technology, and talent, bridging the chains of education, talent, innovation, and industry.

Compliance Management

Employee Conduct Standards

At Boncom, all employees are required, from the start of their employment, to comply with national and local laws and regulations, as well as all company rules, policies, and operating procedures. In our cooperation with business partners, we have established a rigorous supplier management system and ensure that every relevant employee is familiar with and adheres to these rules, to build a safer, higher-quality, and more efficient supply chain system.

The company is committed to technology and integrity. All marketing personnel must strictly follow national laws, regulations, and the company's anti-bribery and fair competition code of conduct. Unethical practices such as improper benefits, false advertising, predatory pricing, or misappropriation of competitors' trade secrets are strictly prohibited. The company has implemented a full-process marketing supervision mechanism — from client engagement and quotation to contract signing — with transparent approval processes and compliance documentation. Regular internal compliance training and behavioral audits are also conducted.

We believe that true market competitiveness stems from advanced process capabilities and reliable product delivery. We are committed to earning customer trust through technical excellence and honest service, and to jointly maintaining a healthy and orderly competitive environment in the semiconductor industry.

Data Protection

From fully transparent network usage to confidential transmission of client data, Boncom has established a complete data protection mechanism. The company maintains a robust information security management system and has dedicated compliance officers responsible for enforcement monitoring and risk assessment.

For core information such as technical documents, process parameters, and design data transmitted to or received from clients, Boncom strictly follows the "minimum necessary" and "segregation of duties" principles. Through tiered access controls and encrypted transmission channels, information is only disclosed to the extent strictly required. All data access must be based on specific business needs and go through approval and traceability procedures, ensuring access is granted only to authorized personnel.

From device usage to employee behavior, Boncom builds a trusted data security barrier through systematic and routine control measures.

Milestones