About Boncom
Founded in 2022, Boncom (Jiaxing) Semiconductor Technology Co., Ltd. ("Boncom Semiconductor") is a leading domestic integrated service provider of compound semiconductor IC manufacturing. Headquartered in Jiaxing, Zhejiang, the company offers wafer fabrication, packaging services, single-step process services, and design enablement.
Boncom Semiconductor has built a domestically leading 4-inch high-grade SiC-based GaN specialty process line, supporting R&D verification, pilot production, and volume manufacturing. This effectively addresses critical industry pain points — such as difficult MPW access and slow validation cycles — accelerating the transition of domestic chips from lab to market. Our products serve a wide range of sectors, including specialized communications, 5G, automotive electronics, new energy, industrial control, power supplies, home appliances, security, networking, and consumer electronics.
Led by a National Talent Program leading expert, who is also a recipient of the State Council Special Government Allowance and a national talent program evaluation expert, the company has assembled a professional team of over 70 members. Most core team members graduated from top universities and bring years of cross-border experience in compound semiconductor wafer fab construction, process development, and product operations.
Boncom Semiconductor will continue to focus on compound semiconductor specialty processes, driven by technological innovation and capacity expansion, to build a globally competitive compound semiconductor manufacturing platform.
Company Culture

Aim High
Think beyond. Stay ambitious. Be inquisitive. Drive your own growth. Strive for excellence.

Stay Grounded
Do what's right, not what's told. Stay steady, stay resilient, and solve Boncom's problems the Boncom way.

Work Hard
Sense of urgency. Resourcefulness. Relentless innovation. Courage to take challenges.

Win Together
See the big picture. Put customers first. Share success. Work as a team.



