As a leading domestic compound semiconductor service provider, Boncom Semiconductor features an expert-led team and a state-of-the-art SiC-based GaN wafer fabrication line. We provide full-process services from R&D to mass production, accelerating the adoption of domestic chips in 5G, radar, and other critical sectors.

Covering diverse GaN HEMT process nodes from 0.25μm to 0.45μm, supporting high-voltage and high-frequency applications. Leveraging SiN passivation, TaN resistors, and via-hole technologies, we deliver outstanding MMIC and power chip manufacturing capabilities.

We offer a comprehensive selection of package options, ranging from standard QFN/DFN and SOT to high-end ACP cavity packages. With rapid delivery capabilities and advanced structural designs, we effectively address the critical challenges of interconnection and heat dissipation for high-frequency chips.

We offer high-precision thinning, laser and blade dicing, as well as automated die sorting services. Supporting a variety of materials including 4"/6" SiC and GaAs, we provide flexible single-process steps tailored to customer needs, enabling ultimate process precision.

Equipped with state-of-the-art analytical instruments including high-temperature operating life (HTOL), temperature/humidity cycling chambers, SEM, FIB, and more, we conduct in-depth failure simulation and root cause diagnosis. We provide systematic reliability assessment for chips, ensuring robustness and compliance throughout the entire product lifecycle.