Equipped with thermal shock/cycling chambers, high-temperature aging chambers, DMA, TMA and other reliability testing equipment, primarily used for temperature/humidity cycling tests and various reliability assessments on chips.

Extensive failure analysis expertise, utilizing FA techniques including SAT, DECAP, X-RAY, SEM, FIB. Through analysis and verification, we simulate and reproduce failure modes, identify root causes, and investigate failure mechanisms to enable effective corrective actions.