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News

Newsnioxe_admin2026-05-22T16:18:30+08:00

  • Boncom NIP2 Process – Ready to Launch!

    2026年5月14日

  • Exhibition Invitation | Boncom Invites You to SICE 2026 in Hangzhou & Zhejiang (Haining) Semiconductor Equipment & Materials Expo in May

    2026年4月29日

  • Technology Breakthrough | Boncom Granted National Invention Patent for Self-Developed Process

    2026年4月27日

  • Milestone | Boncom Achieves ISO 9001 Quality Management System Certification

    2026年4月10日

  • Zhang Bo, Chairman of Boncom, Joins First National IC Standardization Committee's Wide Bandgap Semiconductor Working Group as Member

    2026年4月1日

  • Great News! Boncom Semiconductor Selected as One of Zhejiang Province's 2025 Fourth Batch of National-Level Tech-oriented SMEs

    2025年12月5日

  • Boncom Breaks Ground on GaN RF Power Chip Pilot Line Project in Jiaxing with Total Investment of Approximately RMB 600 Million

    2023年3月1日

Where the mind goes, our chips follow.

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