On April 9, Boncom (Jiaxing) Semiconductor Technology Co., Ltd. officially achieved ISO 9001 certification, marking a pivotal step in standardizing its core R&D and manufacturing processes for integrated circuit wafers. This accreditation underscores the company’s excellence in quality control and comprehensive manufacturing capabilities, laying a solid foundation for its expansion in compound semiconductor advanced manufacturing.

With the ISO 9001 certification secured, Boncom is accelerating the conversion of systematic management into high-quality development momentum. Moving forward, we are deepening our quality governance to continuously optimize process platforms within the compound semiconductor sector.

Boncom will further bolster investments in process innovation, advanced packaging, and supply chain collaboration. By perfecting our services from design-in to mass production, we aim to deliver exceptional value and drive the next phase of industry growth.