Advanced Nodes. Quality Foundry.

Covering diverse GaN HEMT process nodes from 0.25μm to 0.45μm, supporting high-voltage and high-frequency applications. Leveraging SiN passivation, TaN resistors, and via-hole technologies, we deliver outstanding MMIC and power chip manufacturing capabilities.

Precision Packaging. Superior Interconnect.

We offer a comprehensive selection of package options, ranging from standard QFN/DFN and SOT to high-end ACP cavity packages. With rapid delivery capabilities and advanced structural designs, we effectively address the critical challenges of interconnection and heat dissipation for high-frequency chips.

Differentiated. Deep Customization.

We offer high-precision thinning, laser and blade dicing, as well as automated die sorting services. Supporting a variety of materials including 4"/6" SiC and GaAs, we provide flexible single-process steps tailored to customer needs, enabling ultimate process precision.

Full Testing. Quality Assured.

Equipped with state-of-the-art analytical instruments including high-temperature operating life (HTOL), temperature/humidity cycling chambers, SEM, FIB, and more, we conduct in-depth failure simulation and root cause diagnosis. We provide systematic reliability assessment for chips, ensuring robustness and compliance throughout the entire product lifecycle.