High-reliability packaging supporting QFN32, QFN24, QFN16, DFN8, DFN2, SOT89, SOT343, eMSOP8 and other formats (reliability compliant with National Military Grade N1 standard). Packaging yield is consistently maintained above 99%.

Bare copper samples available in as fast as 1.5 days, with production-grade units (including plating) ready in 2 days — yield remains unaffected by the fast turnaround.

High-frequency chip packaging solutions.