Thinning: 4"/6" SiC thinning to ≥75μm; 4"/6" Si thinning to ≥200μm

Laser Scribing: 4"/6" SiC, 50-500μm thickness, chipping ≤15μm, minimum scribe street width of 60μm

Blade Dicing: 100μm SiC-scribe street ≥60μm; 100μm GaAs- scribe street ≥30μm

Die Pick & Sort: Chip sorting from ≥400×400μm down to UV film

Other Process Services: Single-step process services available at various stages per customer requirements