According to relevant reports from the Jiaxing Economic and Technological Development Zone, on March 6 2023, the groundbreaking ceremony for Boncom (Jiaxing) Semiconductor's Gallium Nitride (GaN) RF Power Chip Pilot Line Project was held at the Chengnan Street Industrial Park within the development zone. Targeting the third-generation semiconductor advanced materials sector, the project aims to provide solutions for critical technological bottlenecks.

The project covers an area of 46,667 square meters, with a total investment of approximately RMB 600 million. The first phase occupies about 33,200 square meters. Integrating R&D, production, and sales, the project will accelerate the clustering of electronic information industries in the development zone and strongly support its goal of becoming an innovation-driven manufacturing powerhouse for high-quality economic growth.

According to Boncom Semiconductor's official website, founded in 2022, the company strives to become a leading compound semiconductor manufacturer in China, covering telecommunications infrastructure, RF energy, and various general market applications. It provides high-efficiency semiconductor products and solutions for RF applications such as 5G base stations and broadband communications. In Phase I, Boncom focuses on 4-inch GaN RF chips and power amplifier tubes, establishing a product platform from GaN dies to GaN power amplifier tubes to meet diverse customer application needs. Phase II will extend to 6-inch GaAs RF chip products.

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